ELECTRO--DEPOSITION OF Sn--Ag LEAD--FREE SOLDER BY ALKALINE PYROPHOSPHATE BATH
碱性焦磷酸盐镀液电镀Sn-Ag无Pb钎料的研究

In the road-line map of the lead-free soldering for electronic packaging, the devel opment and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.