%0 Journal Article
%T ELECTRO--DEPOSITION OF Sn--Ag LEAD--FREE SOLDER BY ALKALINE PYROPHOSPHATE BATH<br>碱性焦磷酸盐镀液电镀Sn-Ag无Pb钎料的研究
%A QIAO Mu
%A XIAN Aiping
%A SHANG Jianku Shenyang National Laboratory for Materials Science
%A Institute of Metal Research
%A The Chinese Academy of Sciences
%A Shenyang
%A <br>乔 木
%A 冼爱平
%A 尚建库
%J 金属学报
%D 2004
%I 
%X In the road-line map of the lead-free soldering for electronic packaging, the devel opment and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.
%K lead-free solder
%K electroplating
%K Sn-Ag alloy
%K microelectronic packaging<br>无Pb焊料
%K 电镀
%K Sn-Ag合金
%K 电子封装
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=9101F8C75CED6126&yid=D0E58B75BFD8E51C&vid=1371F55DA51B6E64&iid=5D311CA918CA9A03&sid=2B25C5E62F83A049&eid=4C69616AE50D2DDC&journal_id=0412-1961&journal_name=金属学报&referenced_num=0&reference_num=16