Measurement of Mechanical Properties of Sn--Ag--Cu Bulk Solder BGA Solder Joint Using Nanoindentation
纳米压痕法测量Sn-Ag-Cu无铅钎料BGA焊点的力学性能参数

Berkovich nanoindentation tests with different loading rates have been performed on the Sn-3.0Ag-0.5Cu bulk solder and Sn-4.OAg-0.5Cu lead-free ball grid array (BGA) solder joint. The load-depth curves are rate dependent. The Young's modulus of bulk solder and BGA joint obtained from load-depth curves with Oliver-Pharr method are 9.3 and 20 GPa respectively. The creep rate sensitivity of bulk solder and BGA joint obtained from curves with the concept of " work of indentation " are 0.1111 and 0.0574 respectively. The mechanical properties of Sn-Ag-Cu lead-free solder are typically size dependent.