%0 Journal Article
%T Measurement of Mechanical Properties of Sn--Ag--Cu Bulk Solder BGA Solder Joint Using Nanoindentation<br>纳米压痕法测量Sn-Ag-Cu无铅钎料BGA焊点的力学性能参数
%A WANG Fengjiang
%A QIAN Yiyu
%A MA Xin
%A <br>王凤江
%A 钱乙余
%A 马鑫
%J 金属学报
%D 2005
%I 
%X Berkovich nanoindentation tests with different loading rates have been performed on the Sn-3.0Ag-0.5Cu bulk solder and Sn-4.OAg-0.5Cu lead-free ball grid array (BGA) solder joint. The load-depth curves are rate dependent. The Young's modulus of bulk solder and BGA joint obtained from load-depth curves with Oliver-Pharr method are 9.3 and 20 GPa respectively. The creep rate sensitivity of bulk solder and BGA joint obtained from curves with the concept of " work of indentation " are 0.1111 and 0.0574 respectively. The mechanical properties of Sn-Ag-Cu lead-free solder are typically size dependent.
%K Sn-Ag-Cu
%K nanoindentation
%K Young's modulus
%K creep strain rate sensitivity<br>Sn-Ag-Cu
%K 纳米压痕
%K Young’s模量
%K 应变速率敏感指数
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=74E2C1824B9F6A5E&yid=2DD7160C83D0ACED&vid=2001E0D53B7B80EC&iid=DF92D298D3FF1E6E&sid=FA519F4FF622280A&eid=EEAFC972BAD75B1F&journal_id=0412-1961&journal_name=金属学报&referenced_num=0&reference_num=14