MULTI-SCALE SURFACE EVOLUTION OF COPPER THIN FILMS DEPOSITED BY MAGNETRON SPUTTERING
磁控溅射Cu膜表面形貌演化的多尺度行为

The surface morphologies of Cu thin films deposited by magnetron sputtering were obtained by atomic force microscopy (AFM). From AFM images, power spectrum density (PSD) and roughness measurement methods were proposed to obtain dynamic scaling exponents of the film surface evolution. The results show that the film surface evolution has multi-scale characteristic. The global roughness exponent and growth exponent are 0.83 and 0.85, respectively, whereas the local roughness exponent and growth exponent are 0.88 and 0.26, respectively. The local dynamic surface evolution is consistent with that predicted by surface diffusion-dominated growth model. The global surface dynamic evolution exhibits anomalous scaling characteristic, which arises from bulk diffusion mechanism during the films grown at high temperature.