%0 Journal Article
%T MULTI-SCALE SURFACE EVOLUTION OF COPPER THIN FILMS DEPOSITED BY MAGNETRON SPUTTERING<br>磁控溅射Cu膜表面形貌演化的多尺度行为
%A Jijun Yang
%A <br>杨吉军
%A 徐可为
%J 金属学报
%D 2007
%I 
%X The surface morphologies of Cu thin films deposited by magnetron sputtering were obtained by atomic force microscopy (AFM). From AFM images, power spectrum density (PSD) and roughness measurement methods were proposed to obtain dynamic scaling exponents of the film surface evolution. The results show that the film surface evolution has multi-scale characteristic. The global roughness exponent and growth exponent are 0.83 and 0.85, respectively, whereas the local roughness exponent and growth exponent are 0.88 and 0.26, respectively. The local dynamic surface evolution is consistent with that predicted by surface diffusion-dominated growth model. The global surface dynamic evolution exhibits anomalous scaling characteristic, which arises from bulk diffusion mechanism during the films grown at high temperature.
%K Cu film
%K surface evolution
%K dynamic scaling<br>Cu膜
%K 表面演化
%K 动力学标度
%K 原子力显微镜
%K 磁控溅射
%K 膜表面形貌
%K 演化
%K 尺度行为
%K MAGNETRON
%K SPUTTERING
%K THIN
%K FILMS
%K COPPER
%K EVOLUTION
%K 生长行为
%K 扩散控制
%K 变化
%K 几何形态
%K 晶粒
%K 体扩散
%K 异常
%K 尺度依赖性
%K 薄膜生长机制
%K 差异
%K 生长指数
%K 粗糙度指数
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=874A1CE7C8235F7FDE4E0CCF407EAA42&yid=A732AF04DDA03BB3&vid=BE33CC7147FEFCA4&iid=9CF7A0430CBB2DFD&sid=6484E0C1B87D264C&eid=0FCE62EC9DC00F5E&journal_id=0412-1961&journal_name=金属学报&referenced_num=0&reference_num=21