MECHANISM OF INTERACTION BETWEEN BASE ALUMINUM AND MOLTEN EUTECTIC Sn-Zn ALLOY
Sn-Zn钎料与Al的作用机制

Two interfacial reactions of the eutectic Sn-Zn alloy as filler on the Al substrate during soldering were indicated, i.e., Zn in filler penetrating into Al grain boundaries to form Al-Zn solid solution, and some needle-like Al-Sn-Zn solid solution phases forming and growing into Sn-Zn solid solution. The above reactions make the bonding between filler and substrate to be strengthened more and more.