%0 Journal Article
%T MECHANISM OF INTERACTION BETWEEN BASE ALUMINUM AND MOLTEN EUTECTIC Sn-Zn ALLOY<br>Sn-Zn钎料与Al的作用机制
%A 陈荣
%A 张启运
%J 金属学报
%D 1996
%I 
%X Two interfacial reactions of the eutectic Sn-Zn alloy as filler on the Al substrate during soldering were indicated, i.e., Zn in filler penetrating into Al grain boundaries to form Al-Zn solid solution, and some needle-like Al-Sn-Zn solid solution phases forming and growing into Sn-Zn solid solution. The above reactions make the bonding between filler and substrate to be strengthened more and more.
%K eutectic Sn-Zn alloy
%K soldering
%K Al substrate<br>Sn-Zn共晶合金
%K 钎料
%K 铝
%K 钎焊
%K 腐蚀
%K 固溶结合
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=F844D0D7DF45304944E9B9A83A5A0B9A&yid=8A15F8B0AA0E5323&vid=9971A5E270697F23&iid=CA4FD0336C81A37A&sid=E203FB1A272C9DD2&eid=656F8C8401D91023&journal_id=0412-1961&journal_name=金属学报&referenced_num=6&reference_num=2