STUDY ON THE PROCESS OF COPPER ELECTRODEPOSITION ON PLATINUM (111)
Cu在Pt（111）面上电结晶的成膜过程研究

C-V curves of copper electrodeposition on Pt(111) showed that there were two stages of underpotential and bulk deposition for copper electrodeposition process. Single layer growth at underpotential deposition and three dimensional nucleation growth at bulk deposition had been in situ observed by electrochemical scanning tunneling microscopy (ECSTM) at different potentials and times. The reflection electron microscopy (REM) images also revealed three dimensional growth of Cu deposition at high overpotential. All of these results demonstrated Stranski-Krastanov growth mechanism of copper on Pt(111).