%0 Journal Article
%T STUDY ON THE PROCESS OF COPPER ELECTRODEPOSITION ON PLATINUM (111)<br>Cu在Pt（111）面上电结晶的成膜过程研究
%A YIN Renhe
%A CAO Weimin
%A SHI WenguangSUN JielinMAO Bingwei
%A SUN ShigangCorrespondent: YIN Renhe
%A associate profsson Tel: -
%A Fax:
%A E-mail: papayaly online sh ch
%A <br>印仁和
%A 曹为民
%A 施文广
%A 孙洁林
%A 毛秉伟
%A 孙世刚
%J 金属学报
%D 1998
%I 
%X C-V curves of copper electrodeposition on Pt(111) showed that there were two stages of underpotential and bulk deposition for copper electrodeposition process. Single layer growth at underpotential deposition and three dimensional nucleation growth at bulk deposition had been in situ observed by electrochemical scanning tunneling microscopy (ECSTM) at different potentials and times. The reflection electron microscopy (REM) images also revealed three dimensional growth of Cu deposition at high overpotential. All of these results demonstrated Stranski-Krastanov growth mechanism of copper on Pt(111).
%K underpotential deposition
%K ECSTM
%K REM
%K Stranski-Krastanov growth
%K mechanism<br>欠电位沉积
%K ECSTM
%K REM
%K 铜
%K 铂
%K 薄膜
%K S－K生长
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=ECDC9ECCF881A3E3F5AD5EECE79AB254&yid=8CAA3A429E3EA654&vid=339D79302DF62549&iid=5D311CA918CA9A03&sid=CC5564FFEBD22614&eid=B65E5C7BA0DC04DC&journal_id=0412-1961&journal_name=金属学报&referenced_num=2&reference_num=3