TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE
精细TiN陶瓷薄膜的抗拉强度和界面结合强度

The cantilever bending test, particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion-plated fine TiN film on pure Ti substrate. The behaviours of film damaging were found due to: for TiN facing upward, an exceeded internal tensile stress over its tensile strength, and for TiN facing downward, an exceeded shearing stress along film/substrate interface over its adhesive strength. The measured tensile and adhesive strengths are 603 and 242 MPa respectively.