%0 Journal Article
%T TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE<br>精细TiN陶瓷薄膜的抗拉强度和界面结合强度
%A LIU Changqing
%A LI Meishuan
%A JIN Zhujing
%A WU Weitao
%A <br>刘长清
%A 李美栓
%A 金柱京
%A 吴维
%J 金属学报
%D 1992
%I 
%X The cantilever bending test, particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion-plated fine TiN film on pure Ti substrate. The behaviours of film damaging were found due to: for TiN facing upward, an exceeded internal tensile stress over its tensile strength, and for TiN facing downward, an exceeded shearing stress along film/substrate interface over its adhesive strength. The measured tensile and adhesive strengths are 603 and 242 MPa respectively.
%K tensile strength
%K adhesive strength
%K TiN film<br>TiN薄膜
%K 抗拉强度
%K 结合强度
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=B061E1135F1CBDEE96CD96C109FEAD65&aid=B03C6CF5F0E36C22AA4EDE36DBDC4518&yid=F53A2717BDB04D52&vid=D3E34374A0D77D7F&iid=9CF7A0430CBB2DFD&sid=C753EB8AC8F551B9&eid=BB0EA31DB1B01173&journal_id=0412-1961&journal_name=金属学报&referenced_num=3&reference_num=2