Properties of Films by PECVD Deposition
氢化非晶硅薄膜的性能研究

The properties of the films by PECVD deposition have been studied. The thickness of the film was measured by a spectroscopic ellipsometer. The film stress was analyzed by a stress distribution test instrument. The resistivity, square resistence, TCR and the relation among them were investigated by a four-probe instrument. It has been found that the film by PECVD deposition is symmetrical and its depositon rate is up to 31.89nm/min. The film has low stress and high TCR. Through data analysis, it is concluded that the relation between the resistivity and TCR of the film is nearly linear in a given resistivity range.