HEAT TRANSFER ANALYSIS OF INFRARED NONDESTRUCTIVE TESTING
红外无损检测技术的传热学分析

One dimensional equation of heat conduction, its initial conditions and boundary conditions were described. The surface temperature difference between the flawed and the unflawed regions was given. The surface temperature difference versus heating time, delamination thickness in bonding silicon wafers containing delamination was calculated. The experiment was carried out by using an infrared thermal imager.