%0 Journal Article
%T HEAT TRANSFER ANALYSIS OF INFRARED NONDESTRUCTIVE TESTING<br>红外无损检测技术的传热学分析
%A CHEN Jue
%A <br>陈珏
%J 红外与毫米波学报
%D 2000
%I Science Press
%X One dimensional equation of heat conduction, its initial conditions and boundary conditions were described. The surface temperature difference between the flawed and the unflawed regions was given. The surface temperature difference versus heating time, delamination thickness in bonding silicon wafers containing delamination was calculated. The experiment was carried out by using an infrared thermal imager.
%K infrared nondestructive testing
%K delamination
%K surface temperature difference<br>红外无损检测
%K 脱粘
%K 传热学
%K 红外热像仪
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=D3B4F771D1A06062008B4D0A2EF05996&aid=AA5991DAC9AA5589&yid=9806D0D4EAA9BED3&vid=2A8D03AD8076A2E3&iid=E158A972A605785F&sid=B8F8200D88DDC7D6&eid=334C61CAF4C8EF4E&journal_id=1001-9014&journal_name=红外与毫米波学报&referenced_num=7&reference_num=3