Research on Curing of a Silicon-containing Arylacetylene Resin with Nickelous Diacetyl Acetonate
乙酰丙酮镍催化含硅芳炔树脂的固化反应行为

The curing reaction of silicon-containing arylacetylene resin(PSA) with nickelous diacetyl acetonate(NIAA) was studied,the curing behavior was characterized by gelation time and DSC analysis,curing kinetic parameters were calculated,the curing was traced by FT-IR.The results indicated that the catalytic effect of NIAA on PSA resin was obvious.When 0.2%(ω) nickelous diacetyl acetonate was added in the resin,the apparent activity energy of curing reaction was decreased from 121.2 kJ/mol for PSA resin to 104.2 kJ/mol for PSA-NAA resin and the initial curing temperature decreased by 35℃.Glaser coupling,Strauss coupling,cyclotrimerization and Diels-Alder reaction occurred at different cuing stages of PSA-NIAA resin.The cured PSA?NIAA resin possessed excellent thermal stability.The temperature at 5% weight loss and char yield at 1000℃ of the cured resin with 0.2% NIAA were 620℃ and 87.8% under nitrogen,respectively.