THE PREPARATION OF THE SILICONE RESIN FOR ENCAPSULATION OF ELECTRONIC DEVICES
电子器件包封用聚硅氧烷树脂的合成

The methylphenylsilicone resin, NJ-7401, has been prepared by cohydrolyais and copolycondensation of methyltrichlorosilane, dimethyldichlorosilane and phenyltrichlo-rosilane. The values of CH3+C6H5/Si and C6H5/CH3+C6H5 of resin are 1.2 and 0.5 res-pectively. The resin is suitable for the preparation of molding powder for the encapsulation of electronic devices.