%0 Journal Article
%T THE PREPARATION OF THE SILICONE RESIN FOR ENCAPSULATION OF ELECTRONIC DEVICES<br>电子器件包封用聚硅氧烷树脂的合成
%A C C Li
%A Lin Sy-tsong
%A Ruey Min-jiuan
%A Lei Sheue-lian
%A Wang Dah-chyi
%A Yao Sue-fang
%A Bnu Moo-Ian
%A Shyu Ma-lin
%A <br>李景晟
%A 林思聪
%A 芮敏娟
%A 雷雪莲
%A 王大琦
%A 姚素芳
%A 卜木兰
%A 徐马林
%J 高分子学报
%D 1978
%I 
%X The methylphenylsilicone resin, NJ-7401, has been prepared by cohydrolyais and copolycondensation of methyltrichlorosilane, dimethyldichlorosilane and phenyltrichlo-rosilane. The values of CH3+C6H5/Si and C6H5/CH3+C6H5 of resin are 1.2 and 0.5 res-pectively. The resin is suitable for the preparation of molding powder for the encapsulation of electronic devices.
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=6579068328FE643F&jid=15971983683C7643EE80F1CE621DEB60&aid=723B42F2BA23A8CF&yid=EA437CDB73D9759D&iid=0B39A22176CE99FB&sid=2F56B21F91C9B05B&eid=F122871CC7EC92DC&journal_id=1000-3304&journal_name=高分子学报&referenced_num=0&reference_num=0