FABRICATION OF VARIABLE THICKNESS SUPERCONDUCTING MICROBRIDGES WITH THE PILE-UP MASKING TECHNIQUE
用堆集掩模技术制造变厚超导微桥

A pile-up masking technique using the conventional optical lithography and a two-step or three-step evaporation process is developed to fabricate the variable thickness superconducting microbridges of submicron. The l-V characterise of the microbridges made by the technique is measured at 4.2 k.