FRACTAL INTERPOLATION MODEL OF IC DEFECT OUTLINES
IC缺陷轮廓的分形插值模型

Available defect outline model used for yield prediction and inductive fault analysis of integrated circuits (IC) all model a real defect by replacing its real rugged outlines with circular discs or squares, then great errors were aroused in these models. Based on the idea of fractal interpolation, this paper presents a new model to characterize those real defect outlines. The comparison of the new model with those models available indicates that the new model is a more accurate defect outline model.