%0 Journal Article
%T FRACTAL INTERPOLATION MODEL OF IC DEFECT OUTLINES<br>IC缺陷轮廓的分形插值模型
%A Jiang Xiaohong
%A Zhao Tianxu
%A Hao Yue
%A Xu Guohua
%A <br>姜晓鸿
%A 赵天绪
%A 郝跃
%A 徐国华
%J 电子与信息学报
%D 2000
%I 
%X Available defect outline model used for yield prediction and inductive fault analysis of integrated circuits (IC) all model a real defect by replacing its real rugged outlines with circular discs or squares, then great errors were aroused in these models. Based on the idea of fractal interpolation, this paper presents a new model to characterize those real defect outlines. The comparison of the new model with those models available indicates that the new model is a more accurate defect outline model.
%K IC defect
%K Fractal interpolation
%K IC fault
%K IC yield
%K Equivalent circular defect<br>IC缺陷
%K 分形插值
%K IC故障
%K IC成品率
%K 等效圆形缺陷
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=EFC0377B03BD8D0EF4BBB548AC5F739A&aid=5114230DED71A556&yid=9806D0D4EAA9BED3&vid=BC12EA701C895178&iid=E158A972A605785F&sid=00520952CD4BF212&eid=1C3BB0F444F5E427&journal_id=1009-5896&journal_name=电子与信息学报&referenced_num=0&reference_num=12