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光子学报 1996
THE STUDY OF GaAs EXPITAXIAL PLATE THERMOCOMPORESSION BONDED TO GLASS TECHNOLOGY
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Abstract:
In this paper we reported the process and principle of large-area GaAs epitaxial plate thermocompression bonded to K4 window-glass technology,and emphatically discussed the effects of the deposition of SiN film,the controlling of bonding temperature and the choice of pressure on bonding quality.