%0 Journal Article
%T THE STUDY OF GaAs EXPITAXIAL PLATE THERMOCOMPORESSION BONDED TO GLASS TECHNOLOGY<br>玻璃与GaAs外延片热压粘结工艺研究
%A Sai Xiaofeng
%A Zhang Shuming
%A Gao Hongkai
%A Hou Xun
%A <br>赛小峰
%A 张书明
%A 高鸿楷
%A 侯洵
%J 光子学报
%D 1996
%I 
%X In this paper we reported the process and principle of large-area GaAs epitaxial plate thermocompression bonded to K4 window-glass technology,and emphatically discussed the effects of the deposition of SiN film,the controlling of bonding temperature and the choice of pressure on bonding quality.
%K Thermocompression bonding
%K Window-glass
%K GaAs epitaxial plate<br>热压粘结
%K 玻璃
%K GaAs外延片
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=47EA7CFDDEBB28E0&jid=9F6139E34DAA109F9C104697BF49FC39&aid=6EA4A38ED3B8AA2EE23ED0D93A3A42EA&yid=8A15F8B0AA0E5323&vid=C5154311167311FE&iid=0B39A22176CE99FB&sid=0B4F496D54044D86&eid=BA79719BCA7341D5&journal_id=1004-4213&journal_name=光子学报&referenced_num=1&reference_num=0