STUDY OF ELECTROLESS COPPER PLATING FROM COPPER-GLYCERIN COMPLEX SOULTION
甘油铜络合物溶液化学镀铜的研究

The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated. The formulation of bath solution and processing parameters were established by the research. The results show that the proposed bath solution was highly stabile, by which cupper plating had high deposition rate with good appearence. Therefore, the copper-glycerin camplex solution shows a good prospect for copper plating.