%0 Journal Article
%T STUDY OF ELECTROLESS COPPER PLATING FROM COPPER-GLYCERIN COMPLEX SOULTION<br>甘油铜络合物溶液化学镀铜的研究
%A WANG Hong-xian
%A ZHAO Hong-kun
%A <br>王鸿显
%A 赵红坤
%J 腐蚀科学与防护技术
%D 2007
%I 
%X The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated. The formulation of bath solution and processing parameters were established by the research. The results show that the proposed bath solution was highly stabile, by which cupper plating had high deposition rate with good appearence. Therefore, the copper-glycerin camplex solution shows a good prospect for copper plating.
%K copper - glycerin complex
%K electroless copper plating
%K deposition rate
%K bath stability<br>甘油铜络合物
%K 化学镀铜
%K 沉铜速度
%K 镀液稳定性
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=AB188D3B70B071C57EB64E395D864ECE&jid=9F6E6EC8BA5BB62698F6640073DDD6E1&aid=87AE0DDC882B12AD&yid=A732AF04DDA03BB3&vid=2A8D03AD8076A2E3&iid=38B194292C032A66&sid=4609832E4B5C797B&eid=F1A8654ADB4E656E&journal_id=1002-6495&journal_name=腐蚀科学与防护技术&referenced_num=0&reference_num=9