INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD
圆片冲击法测定硅片抗弯强度的研究

A test method for measuring flexure strength of silicon wafer is investigatedwhich adopts circular wafer sample and impact loading.Combining kinetic energy theoremand small deflection sheet theory,We derive the formula calculating flexure strength.Theaccuracy is satisfactory.