%0 Journal Article
%T INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD<br>圆片冲击法测定硅片抗弯强度的研究
%A XieShuyin
%A ShiZhiyi
%A <br>谢书银
%A 石志仪
%J 力学学报
%D 1995
%I 
%X A test method for measuring flexure strength of silicon wafer is investigatedwhich adopts circular wafer sample and impact loading.Combining kinetic energy theoremand small deflection sheet theory,We derive the formula calculating flexure strength.Theaccuracy is satisfactory.
%K flexure strengtht silicon wafer
%K impact loading
%K sheet
%K small deflection<br>抗弯强度
%K 硅片
%K 冲击载荷
%K 弯曲试验
%K 脆性材料
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=4100DA4A1A3BA1B0CE5AD99AE1DFB420&aid=18E4054FCB3C7B86B477ED1F3216B44E&yid=BBCD5003575B2B5F&vid=DB817633AA4F79B9&iid=38B194292C032A66&sid=A7AE820C12CC9AD3&eid=05340B75C67FF664&journal_id=0459-1879&journal_name=力学学报&referenced_num=3&reference_num=3