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半导体学报 2009
Development and characteristics analysis of recessed-gate MOS HEMT
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Abstract:
研制出蓝宝石衬底的槽栅AlGaN/GaN MOS HEMT。器件栅长1um,源漏间距4um,在4V栅压下器件饱和电流达到684mA/mm,最大跨导219 mS/mm,ft和fmax分别为9.2GHz和14.1GHz。相比未刻槽的MOS HEMT,最大跨导提高24.3%,相比金半接触的常规结构HEMT,肖特基泄漏电流减小2个数量极