RLC Interconnect Delay with Temperature Distribution Effects
考虑温度分布效应的RLC互连延时分析

Based on the equivalent Elmore delay and the concept of piecewise distributed parameters,an analytical model of RLC interconnect delay is presented.In this model,the influence of inductance and temperature is taken into account,which is close to the fact and of great importance in practice.Results show that the proposed model has less than 10% error for simple RLC interconnect trees and is very high in simulation efficiency.