%0 Journal Article
%T RLC Interconnect Delay with Temperature Distribution Effects<br>考虑温度分布效应的RLC互连延时分析
%A Yang Yintang
%A Leng Peng
%A Dong Gang
%A Chai Changchun
%A <br>杨银堂
%A 冷鹏
%A 董刚
%A 柴常春
%J 半导体学报
%D 2008
%I 
%X Based on the equivalent Elmore delay and the concept of piecewise distributed parameters,an analytical model of RLC interconnect delay is presented.In this model,the influence of inductance and temperature is taken into account,which is close to the fact and of great importance in practice.Results show that the proposed model has less than 10% error for simple RLC interconnect trees and is very high in simulation efficiency.
%K delay
%K temperature distribution
%K RLC interconnect<br>延时
%K 温度分布
%K RLC互连
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=F1901577122942B6FE9AACBDD0967E66&yid=67289AFF6305E306&vid=771469D9D58C34FF&iid=9CF7A0430CBB2DFD&sid=1AA24020BCD2D13D&eid=B1F4011810AAA181&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=8