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OALib Journal期刊
ISSN: 2333-9721
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Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint
SMT焊点形态成形和焊点可靠性CAD

Keywords: SMT,Solder Joint,CAD
表面组装技术
,焊点,计算机辅助设计

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Abstract:

PBGA solder joint is taken as example for CAD study of solder joint evolving and thermal fatigue life,integration design thought of solder evolving and reliability is presented.After realization method is analyzed,realization process in detail is provided and results are shown.

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