%0 Journal Article
%T Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint<br>SMT焊点形态成形和焊点可靠性CAD
%A ZHOU De
%A |jian
%A PAN Kai
%A |lin
%A LIU Chang
%A |kang
%A <br>周德俭
%A 潘开林
%A 刘常康
%J 半导体学报
%D 2000
%I 
%X PBGA solder joint is taken as example for CAD study of solder joint evolving and thermal fatigue life,integration design thought of solder evolving and reliability is presented.After realization method is analyzed,realization process in detail is provided and results are shown.
%K SMT
%K Solder Joint
%K CAD<br>表面组装技术
%K 焊点
%K 计算机辅助设计
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=5470571735E290CA&yid=9806D0D4EAA9BED3&vid=659D3B06EBF534A7&iid=0B39A22176CE99FB&sid=02DC3A182A5530DF&eid=2B25C5E62F83A049&journal_id=1674-4926&journal_name=半导体学报&referenced_num=6&reference_num=6