Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度

The shear strength of COG and COF bonded with ACF is studied by impact test.The results show that the shear strength of COF is higher than that of COG.There is the maximum dynamic shear strength when the curing degree of ACF is about 85%.The dynamic strength of ACF is influenced strongly by the factors of bonding temperature,particle shapes,and defects,but slightly by the bonding pressure.