%0 Journal Article
%T Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film<br>倒装芯片各向异性导电胶互连的剪切结合强度
%A Wu Fengshun
%A Wu Yiping
%A Wu Boyi
%A Chen Li
%A <br>吴丰顺
%A 吴懿平
%A 邬博义
%A 陈力
%J 半导体学报
%D 2004
%I 
%X The shear strength of COG and COF bonded with ACF is studied by impact test.The results show that the shear strength of COF is higher than that of COG.There is the maximum dynamic shear strength when the curing degree of ACF is about 85%.The dynamic strength of ACF is influenced strongly by the factors of bonding temperature,particle shapes,and defects,but slightly by the bonding pressure.
%K anisotropic conductive film
%K shear strength
%K flip chip on glass
%K flip chip on flex<br>各向异性导电胶膜
%K 剪切强度
%K 玻璃上倒装芯片
%K 柔性基板上倒装芯片
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=5D303054FC09ED1D&yid=D0E58B75BFD8E51C&vid=C5154311167311FE&iid=38B194292C032A66&sid=9D9F10A828991FA6&eid=3622B70F9C54A9CC&journal_id=1674-4926&journal_name=半导体学报&referenced_num=4&reference_num=11