Damage of Bonding Force on IC Aluminum Pad in COF Structure
COF结构中键合力损伤芯片Al层的研究

The impact of bonding force on Al pad in IC chip,and the maximum bonding force are achieved by both experimental and simulative methods.Track width and misalignment are two main factors studied.The former affects the foil and interconnect design;while the later is related to manufacturing tolarence and bonding machine accuracy.It is shown that the bonding force,track width and misalignment have great influence on the maximum stress in the aluminum pad of the IC.