%0 Journal Article
%T Damage of Bonding Force on IC Aluminum Pad in COF Structure<br>COF结构中键合力损伤芯片Al层的研究
%A Peng Yaowei
%A Chan Justy
%A Wang Zhiping
%A and Xiao Fei
%A <br>彭瑶玮
%A 陈文庆
%A 王志平
%A 肖斐
%J 半导体学报
%D 2005
%I 
%X The impact of bonding force on Al pad in IC chip,and the maximum bonding force are achieved by both experimental and simulative methods.Track width and misalignment are two main factors studied.The former affects the foil and interconnect design;while the later is related to manufacturing tolarence and bonding machine accuracy.It is shown that the bonding force,track width and misalignment have great influence on the maximum stress in the aluminum pad of the IC.
%K chip on foil
%K non-conductive film
%K Au-Au eutectic
%K finite element simulation<br>挠性板上芯片
%K 非导电膜
%K 金-金共金
%K 有限元模拟
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=4C37FC46772B78F9&yid=2DD7160C83D0ACED&vid=96C778EE049EE47D&iid=CA4FD0336C81A37A&sid=79D2EF35F60110C2&eid=797D49279EA93BC4&journal_id=1674-4926&journal_name=半导体学报&referenced_num=1&reference_num=9