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半导体学报 1990
Fabrication of WSi_x Micron Structures Using RIE in SF_6-N_2 Mixture
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Abstract:
This paper reports experiments on reactive ion etching of WSi_x using SF_6-Ar and SF_6-N_2as etchants.Etching characteristics are well studied with SF_6-N_2 system. N_2 is found to besuperior as a diluent of SF_6 in etching micrometen structures of WSi_x, and having good repeatability.GaAs MESFET and OEIC devices have been fabricated with the etching.