Criterion of Gap Closing for Silicon Wafer Bondability
硅片发生室温键合所需的平整度条件

A criterion of the gap closing between contact surfaces is studied according to elastic mechanics of thin plate.The important factors influencing the gaps closing include the gap height,the spatial wavelength,the specific surface energy of adhesion,the material deformability and the silicon wafer thickness.It is easier for the thin silicon wafers bonding than for the thick one.