%0 Journal Article
%T Criterion of Gap Closing for Silicon Wafer Bondability<br>硅片发生室温键合所需的平整度条件
%A HAN Wei
%A hua
%A YU Jin
%A zhong
%A <br>韩伟华
%A 余金中
%J 半导体学报
%D 2001
%I 
%X A criterion of the gap closing between contact surfaces is studied according to elastic mechanics of thin plate.The important factors influencing the gaps closing include the gap height,the spatial wavelength,the specific surface energy of adhesion,the material deformability and the silicon wafer thickness.It is easier for the thin silicon wafers bonding than for the thick one.
%K gaps between contact surfaces
%K roughness
%K the elastic deformation of thin plate<br>室温键合界面缝隙
%K 粗糙度
%K 薄板弹性形变
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=4A34BA1973E825BD&yid=14E7EF987E4155E6&vid=BC12EA701C895178&iid=59906B3B2830C2C5&sid=CA590345B99F3387&eid=F53B1922DFC7BC64&journal_id=1674-4926&journal_name=半导体学报&referenced_num=2&reference_num=5