Effect of Wafer Surface Morphology Characteristics on Wafer Bonding
晶片表面几何特性对键合的影响

A general wafer bonding criterion is deduced from minimum energy principle,which is developed by linear elastic thin plate theory.Under the same framework the effect of macro-scale wafer bow and micro-scale wafer waviness on wafer bonding process are modeled through the elastic strain energy accumulation rate which is the quantity that controls bonding.Model results are discussed respectively in detail.