%0 Journal Article
%T Effect of Wafer Surface Morphology Characteristics on Wafer Bonding<br>晶片表面几何特性对键合的影响
%A Chen Bin
%A Huang Yongqing
%A REN Xiaomin
%A <br>陈斌
%A 黄永清
%A 任晓敏
%J 半导体学报
%D 2005
%I 
%X A general wafer bonding criterion is deduced from minimum energy principle,which is developed by linear elastic thin plate theory.Under the same framework the effect of macro-scale wafer bow and micro-scale wafer waviness on wafer bonding process are modeled through the elastic strain energy accumulation rate which is the quantity that controls bonding.Model results are discussed respectively in detail.
%K wafer bonding
%K surface energy
%K adhesion energy
%K linear elastic thin plate theory<br>晶片键合
%K 表面能
%K 吸附能
%K 线性薄板理论
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=1EAB21DF8A5EC292&yid=2DD7160C83D0ACED&vid=96C778EE049EE47D&iid=E158A972A605785F&sid=CE16DE2ABCD4D365&eid=849A5A9D85EBE6D4&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=6