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半导体学报 2005
Thermal Simulation of Silicon Gas Flow Sensor and Its Packaging
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Abstract:
Based on the packaging of a silicon gas flow sensor,a simplified one-dimensional analytical model is given.The FEA thermal model of the sensor is also built with ANSYS/FLOTRAN.The simulation results show that the temperature field of the ceramic packaged sensor is similar to that of unpackaged one,which proves the feasibility of this packaging scheme.The performances of packaged and unpackaged sensor is compared and the influence of the structure parameters on the thermal performance of the sensor are also discussed in detail.The thermal model and its analysis provide a simple method for the optimization design of the packaging of the gas flow sensor.
