%0 Journal Article
%T Thermal Simulation of Silicon Gas Flow Sensor and Its Packaging<br>硅热流量传感器封装的热模拟分析
%A Gao Donghui
%A Qin Ming
%A Huang Qing''''an
%A <br>高冬晖
%A 秦明
%A 黄庆安
%J 半导体学报
%D 2005
%I 
%X Based on the packaging of a silicon gas flow sensor,a simplified one-dimensional analytical model is given.The FEA thermal model of the sensor is also built with ANSYS/FLOTRAN.The simulation results show that the temperature field of the ceramic packaged sensor is similar to that of unpackaged one,which proves the feasibility of this packaging scheme.The performances of packaged and unpackaged sensor is compared and the influence of the structure parameters on the thermal performance of the sensor are also discussed in detail.The thermal model and its analysis provide a simple method for the optimization design of the packaging of the gas flow sensor.
%K finite element analysis
%K silicon gas flow sensor
%K packaging
%K thermal simulation<br>有限元分析
%K 硅热流量传感器
%K 封装
%K 热模拟
%K 硅热流量传感器
%K 封装传感器
%K 热模拟分析
%K Packaging
%K Sensor
%K Gas
%K Flow
%K Silicon
%K Simulation
%K 理论
%K 优化设计
%K 模拟结果
%K 研究
%K 计算量
%K 过程
%K 热模型
%K 关系
%K 特征尺寸
%K 热性能
%K 差异
%K 比较
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=F8E22C9C652F00D7&yid=2DD7160C83D0ACED&vid=96C778EE049EE47D&iid=0B39A22176CE99FB&sid=869B6F3117981EC4&eid=965F4E89CD0AFC30&journal_id=1674-4926&journal_name=半导体学报&referenced_num=5&reference_num=7