Theoretical Analysis of Stresses in Interface of Bonded Wafers
晶片键合界面应力分布的理论分析

The theoretical distribution of stresses in the interface of bonded wafers and thin films subjected to uniform heating or cooling are studied according to the theory of stresses arising in bimetal strips.The characteristics of distribution of the shearing stresses,as well as normal and peeling stresses which influence the quality of bonded wafers are discussed.