%0 Journal Article
%T Theoretical Analysis of Stresses in Interface of Bonded Wafers<br>晶片键合界面应力分布的理论分析
%A Zhou Zhen
%A Kong Xijun
%A Huang Yongqing
%A Ren Xiaomin
%A <br>周震
%A 孔熹峻
%A 黄永清
%A 任晓敏
%J 半导体学报
%D 2003
%I 
%X The theoretical distribution of stresses in the interface of bonded wafers and thin films subjected to uniform heating or cooling are studied according to the theory of stresses arising in bimetal strips.The characteristics of distribution of the shearing stresses,as well as normal and peeling stresses which influence the quality of bonded wafers are discussed.
%K bonding
%K shearing stress
%K normal stress
%K peeling stress<br>键合
%K 剪应力
%K 正应力
%K 剥离应力
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=A44454F783DB1E6F&yid=D43C4A19B2EE3C0A&vid=B91E8C6D6FE990DB&iid=708DD6B15D2464E8&sid=2613941CBDF71B5D&eid=4206C58D935377EA&journal_id=1674-4926&journal_name=半导体学报&referenced_num=3&reference_num=4