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半导体学报 1990
A Study of Catalyst and Technology of Deep-UV Development-Free Photolithography
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Abstract:
A new catalyst has been developed.It consists of common organic compound (For examplemethyl violet etc.), CMPS resin and certain solvent.Experiments of the catalyst havebeen done with deep-UV exposure.The results demonstrate that sensitivity and resolution ofthe catalyst film are very high.The etching rate of SiO_2 increases due to the coating of thecatalyst.
