A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects
一种新型的集成电路金属连线温度分析解析模型

A novel analytical thermal model for estimating the temperature rise of multilevel ULSI interconnects is presented,and the impact of joule heating,via effect,and heat fringing effect is investigated in details.After considering the via effect and heat fringing effect of multilevel ULSI interconnects,LTem provides more accurate temperature estimation of the multilevel interconnects.