%0 Journal Article
%T A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects<br>一种新型的集成电路金属连线温度分析解析模型
%A Wang Nailong
%A Zhou Runde
%A <br>王乃龙
%A 周润德
%J 半导体学报
%D 2004
%I 
%X A novel analytical thermal model for estimating the temperature rise of multilevel ULSI interconnects is presented,and the impact of joule heating,via effect,and heat fringing effect is investigated in details.After considering the via effect and heat fringing effect of multilevel ULSI interconnects,LTem provides more accurate temperature estimation of the multilevel interconnects.
%K Joule heating
%K via effect
%K heat fringing effect
%K thermal conductivity<br>焦耳热
%K 通孔效应
%K 边缘传热效应
%K 热传导
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=A9417C903802827B&yid=D0E58B75BFD8E51C&vid=C5154311167311FE&iid=708DD6B15D2464E8&sid=C32BEECEF5323D34&eid=B7C6D333F9B9ED14&journal_id=1674-4926&journal_name=半导体学报&referenced_num=4&reference_num=8