Fabrication and Packaging of an Inertia Electrical Micro-Switch Using Low Temperature Metal-Electroplating Technology
用低温金属电镀技术制造与封装的惯性微型电学开关

Presented in this paper is a separate and non-interfering photoresist-molded,metal-electroplating technology for the low-temperature fabrication and packaging of inertia electrical micro-switch.The low temperature process of the electroplating technology allows eventual modular integration and wafer-level packaging of the micro-switches on active substrates containing pre-fabricated electronic signal-processing circuits.The height of the inertia micro-switch and that of its cavity are independently controlled.Metal leads are provided for electrical access to the sealed cavities.The switches are designed using a simple but accurate lumped spring-mass model.Un-encapsulated switches making over 100 million contacts are demonstrated in room ambient.Both the strength and the hermeticity of the sealed cavity are tested and reported.