%0 Journal Article
%T Fabrication and Packaging of an Inertia Electrical Micro-Switch Using Low Temperature Metal-Electroplating Technology<br>用低温金属电镀技术制造与封装的惯性微型电学开关
%A Yitshak Zohar
%A Ma Wei
%A Yitshak Zohar
%A Wong Man
%A <br>马薇
%A Yitshak
%A Zohar
%A 王文
%J 半导体学报
%D 2005
%I 
%X Presented in this paper is a separate and non-interfering photoresist-molded,metal-electroplating technology for the low-temperature fabrication and packaging of inertia electrical micro-switch.The low temperature process of the electroplating technology allows eventual modular integration and wafer-level packaging of the micro-switches on active substrates containing pre-fabricated electronic signal-processing circuits.The height of the inertia micro-switch and that of its cavity are independently controlled.Metal leads are provided for electrical access to the sealed cavities.The switches are designed using a simple but accurate lumped spring-mass model.Un-encapsulated switches making over 100 million contacts are demonstrated in room ambient.Both the strength and the hermeticity of the sealed cavity are tested and reported.
%K inertia micro-switch
%K threshold acceleration
%K electroplating
%K packaging
%K eutectic solder-bonding
%K hermeticity<br>惯性微型开关
%K 阈值加速度
%K 电镀
%K 封装
%K 共晶焊料熔接
%K 密封性
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=9364F8A9A0D46B3D&yid=2DD7160C83D0ACED&vid=96C778EE049EE47D&iid=B31275AF3241DB2D&sid=1C7C31A28F5ECC6F&eid=3559FBE006544B4B&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=9